How an electronics systems cooling (ESC) digital twin can ensure electronics meet thermal requirements
How hot can an electronics package get?
Media stories of cell phones smoldering and igniting under pillows are a sure-fire way to gain the wrong kind of attention and lose customers. More common overheating and thermal degradation issues may not be quite so alarming but, nevertheless, they can cause significant problems and damage.
As devices get smaller and thinner, the technical challenges of designing sophisticated electronics systems grows. Operational and safety measures are non-negotiable, and with mechanical and electrical design teams working under competing requirements, collaboration is essential.
Does the electronics package meet operation and safety thermal requirements? Is the thermal energy dissipation enough to protect the components? These are critical questions.
Efforts to optimize the design of electronics systems and packages can yield improvements in safety, quality, efficiency and customer experience.
- 68% of electronics equipment manufacturers cite ECAD-MCAD collaboration as a significant product design challenge
- 50% of complex products require at least one additional design iteration to fix electro-mechanical problems
(Data from Siemens)
How can ECAD and MCAD specialists work together more efficiently?
Collaboration is key. The PCB Exchange application greatly facilitates cross-team workflows. Designers, engineers, and manufacturers who use a multidisciplinary product development platform benefit from seamless and intuitive workflows and a significant advantage in creating and maintaining ESC digital twins. The results are better designs that optimize operational temperatures and ensure the reliability of nearby components.
Have you struggled to:
- Create and maintain digital representation of your product?
- Include all of the relevant physics in the simulation?
- Verify that the electronics package performs as intended?
- Find the optimal design?
- Integrate more sophisticated workflows?
The Digital Twin and the multidisciplinary Simcenter 3D platform make it all possible.
Companies that succeed in transforming their performance engineering processes are able to engineer innovation and improve market agility to bring better products to market faster, and at a lower cost.
In part 2 of this series, we walk you through the detailed steps to create and maintain an electronics systems cooling digital twin in Simcenter 3D.
Learn more about Simcenter 3D