The thermal analysis module performs a variety of analyses in the domain of heat transfer, specifically for large assemblies and complex models
As part of the Simcenter 3D simulation package, the thermal analysis module technology is a fully-integrated module in Simcenter 3D’s portfolio and acts an add-on to Simcenter 3D. The thermal analysis module performs a variety of analyses in the domain of heat transfer, specifically for large assemblies and complex models. In simulating phenomena such as conduction, convection, and radiation, the solution is deployed across a wide array of industries including space, aerospace, military and defense, automotive, consumer goods, medical, energy, electronics, and semi-conductors. The thermal analysis module also offers engineers and analysts the ability to perform multi-physical simulations with the host of Simcenter’s other modules, including solutions such as the CFD-integrated solution, the flow simulation module. Drawing on Siemens’ tradition of thermal analysis technology dating back to I-deas TMG, The thermal analysis module simulates conditions on FE Meshes using high-order finite volume-based technology.
Coupled thermo-fluid and thermo-elastic simulations: Thermal modeling capabilities within the thermal analysis module can be seamlessly combined with the flow simulation module or the advanced flow to simulate fully-coupled thermo-fluid interactions problems, including integration of radiative heat transfer. The thermal analysis module and the flow simulation module combined together offers both conduction and radiation modeling fully coupled with 3D fluid flow. As well, for thermo-elastic analysis, the thermal analysis module temperature results can be mapped to a separate Nastran FE model.
The thermal analysis module’s integration into the Simcenter 3D portfolio allows users to benefit from the Simcenter 3D advanced FEM environment. Synchronous technology allows for quick modifications to geometry and distributed meshing workflows with Assembly FEM capabilities. As the thermal model is synchronized with the NX design and assembly intent through NX data associativity, designers, engineers, and thermal specialists can avoid any transfer of additional input files or geometric manipulations or conversions that would break the associative link between NX geometry and FE tasks. This means that the thermal mesh is automatically updated with every design or assembly modification.
NX presents Simcenter 3D and the thermal analysis module users with a useful set of tools to generate thermal models as well as geometry ready for analysis. Users have the ability to either manually or automatically create idealized parts where abstraction of unnecessary geometrical features can easily be achieved due to associativity with the NX part and assembly context. Parts can be modeled quickly using precise sketches, surfaces, and solid geometry with automated free meshing tools.
Being a key component of Simcenter 3D simulation and the NX environment, NX enables users to model, catalog, and share parts and material libraries with the NX design team, reducing the margin for costly errors caused by unnecessary rework.
Thermal couplings for joining disjoint solid or surface meshes within NX assembly context: Thermal couplings is a conductance between unconnected parts and components with different meshes. This provides a unique capability for building assemblies by modeling heat flow between the conductance and creating multiple what-if scenarios and positioning parts.